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PCB Capabilities
Learn about our PCB Manufacturing & Assembly Capabilities
PCB Specifications
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Layer count | 1~24 layers | Mass production up to 22 layers | |
| Material | FR-4, HF FR-4, FR-4 HTG, Aluminium-Core, Ceramic, PTFE | Specific materials available upon request | |
| Maximum Dimensions | 610mm x 450mm; dependant upon laser drilling machine |  | |
| Minimum Dimensions | 3mm*3mm | ||
| Dimension Tolerance | ±0.1mm | ||
| HDI Capability | HDI: 1+1+N+1+1, 2+N+2. 3+N+3 (≥4 orders require evaluation） | ||
| Impedance Tolerance | ≥50Ω, ±8%; < 50Ω, ±4ohm | ||
| Thickness | 0.2-0.4mm (evaluation required for less than 0.2mm or greater than 4mm) | ||
| Thickness Tolerance | ±0.05~±0.1mm | Depends on the layer count | |
| Base copper thickness | Inner layer:8µm~150µm | Up to 175µm for prototype | |
| Outer layer:8µm~140µm | |||
| Soldermask | Green, Black, Yellow, Red, White, Blue, Red | Any color upon request | |
| Surface Finish | HASL (leaded / lead-free), ENIG, OSP, Gold finger,Electrolytic gold |
Drilling
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Drill Diameter | 0.15~6.5mm Laser drilling: minimum 0.1mm, advanced 0.075mm |  | |
| Hole size Tolerance (Plated) | ±0.04mm |  | |
| Hole size Tolerance (Non-Plated) | ±0.025mm |  | |
| Via type | Blind via, Buried via, Through-hole |  | |
| Min. Via hole size/diameter | 0.15mm/0.25mm |  | |
| Min. Plated Slots | 0.55mm |  | |
| Min. Non-Plated Slots | 1.0mm |  |
Traces
| Features | Capability | Description | Patterns |
|---|---|---|---|
| Min. track width and spacing(Inner layer) | 1/2oz: 0.075mm/0.075mm 1/1oz: 0.075/0.1 2/2oz: 0.10/01.3 |  | |
| Min. track width and spacing(Outer layer) | 0.07mm/0.07mm | ||
| Track width tolerance | ±20% | e.g. For a 0.1 mm track, the finished track width ranges from 0.08 and 0.12 mm. | |
| Min. annular ring | 0.18mm | Depends on layer count |  |
| Min. BGA pad | 0.15mm |  | |
| Min. hatched grid width and spacing | 0.15mm/0.2mm | For outer layers |  |
| Min. via hole to track | 0.18mm | Depends on layer count |  |
Solder mask
| Features | Capability | Description | Pattern |
|---|---|---|---|
| Soldermask Opening | 1. For 2oz copper base, the soldermask opening should be 0.075mm larger than the original trace width (non-plating edge) 2. For solder bridge prevention, IC pads and SMT component pads can have a soldermask opening up to 0.04mm larger per edge 3. Soldermask opening on pads must ensure a minimum solder mask overlap of 0.05mm on the pad 4. Soldermask opening around plated edges should be enlarged by 0.02mm (tolerance +/-0.03mm, and for BGA enlarged by 0.04mm) 5. vias design must have a clearance of 0.1mm or more from the pads, or be completely within the solder pad area, otherwise it will result in voids |  | |
| Soldermask Bridge | Min pad spacing 0.1mm for green; min pad spacing 0.15mm for other colours | the best we can do for green is 0.07 and 0.1 for other colours; please confirm with us if needed |  |
| Soldermask Colour | Green, Black, White, Yellow, Blue ,Red or any colour requested | Green soldermask is free; other colours might be charged accordingly | |
| Via-in-Pad Process | 1.Epoxy Filled & Capped 2.Copper paste Filled&Capped | Vias are plugged with either epoxy resin or copper paste, followed by surface plating to create an opaque and smooth finish. |  |
| Soldermask Thickness | 1.Trace Surface: ≥6 µm 2.Trace Corner: ≥5 µm 3.Base Material Surface: 20–40 µm (for total copper thickness less than 2 oz) 4. When the copper thickness exceeds 2 oz, double printing is required, thickness on Base Material Surface should be 25–60 µm |  |
Legend
| Features | Capability | Description | Pattern |
|---|---|---|---|
| Minimum Line Width | 0.12mm |  | |
| Minimum text height | 0.6mm |  | |
| Minimum pad/via to text | 0.25mm | the best we can do is 0.2mm, please let us know if needed |  |
| Silkscreen colour | White, Black, Yellow, Blue, Green | any colour as requested |
Outline
| Features | Capability | Description | Pattern |
|---|---|---|---|
| Routing | Min trace to edge: 0.2mm | 1.Outline tolerance: ±0.10mm 2.Maximum board dimensions: 550×440mm 3. Slot, concave slot, and opening slot width: ≥0.8mm 4.Minimum hole-to-edge distance: -For board thickness ≥0.4mm: ≥0.2mm -For board thickness <0.4mm: ≥0.25mm | |
| Punching | Min trace to edge: 0.25mm | 1.Maximum panel dimensions: -Outline: 350×350mm -Unit size: 160mm×200mm (non-battery board) -Battery board unit maximum: 125mm×145mm (using A/B punch) 2. Outline tolerance: ±0.1mm, non-halogen board limit ±0.075mm 3.Via diameter tolerance: ±0.05mm 4.Min via to edge distance: 0.25mm 5.Min square hole dimensions: -For thickness ≤0.6mm: 0.8×0.8mm -For thickness 0.6-1.3mm: 1.2×1.2mm -For thickness >1.3mm: 1.5×1.5mm | |
| V-cut | Min trace to edge: 0.3mm | 1. Angle: 20 degrees 2.Maximum dimensions: -Automatic: 620×620mm -Manual: 300×300mm 3.Minimum dimensions: -Automatic: 200×200mm -Manual: 80×40mm 4. V-CUT spacing (Manual): ≥9mm 5. V-CUT depth: normally based on the board thickness, could be adjusted as required 6. V-CUT trace to board edge: -Manual: Minimum required 3mm |
| Feature | Capability |
|---|---|
| Layer Count | FPC: 2-8 layers, RFPC: 2-10 layers |
| Finished Board Size (Max) | 500mm*1800mm |
| Major CCL Brand | Doosan, Thinflex, Shengyi, Taiyo, DongYi |
| Finished Board Thickness Tolerance | ±10% |
| Minimum mechanical drill | 0.15mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
| Base Copper Thickness of Outer Layer | 1/3 OZ-1.5 OZ (0.012mm - 0.05mm) |
| Base Copper Thickness of Inner Layer | 1/3 OZ-1.5 OZ (0.012mm - 0.05mm) |
| Board Thickness(withour stiffener) | 0.07mm-2.0mm |
| Aspect Ratio of Plated Hole (Max) | 8:1 |
| Hole Diameter Tolerance (PTH) | ±0.05mm |
| Hole Diameter Tolerance (NPTH) | ±0.05mm |
| Copper Thickness of PTH Wall | 10μm min or meet customer requirement |
| Design Line Width/Space of Inner Layer (Min) | 0.05/0.05mm |
| Design Line Width/Space of Outer Layer (Min) | 0.05/0.05mm |
| Solder Mask Bridge Width (Min) | 0.08mm |
| Solder Mask Alignment Tolerance | ±2mil (±0.05mm) |
| Coverlay Bridge Width (Min) | 8mil (0.2mm) |
| Coverlay Alignment Tolerance | ±6mil (±0.15mm) |
| Dimension Tolerance (Hole to Edge) | ±4mil (±0.1mm) |
| Test Capacity | PAD Size min (0.1mm), PAD Pitch min (0.4mm) |
| Profile method | Laser cutting, Punching |
| Stiffener Type | PI, FR4, Aluminium, Stainless Steel |
| Surface Treatment | HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold, Hard gold, Immersion silver and OSP, Immersion tin |
| Process | Item | Production Capability |
|---|---|---|
| Printing | Max printable size | 2000*250mm |
| Printing accuracy | ±25μm (6σ) | |
| System calibration repeat accuracy | ±10μm (6σ) | |
| Scraper pressure detection | Pressure closed-loop control system | |
| SPI | Min detectable solder ball spacing | 100μm |
| X-Y axis accuracy | 0.5μm | |
| Error rate | ≤0.1% | |
| SMT | Min component size range | 0.6*0.3mm²—174*150mm² |
| Max component height | 25mm | |
| Max component weight | 100g | |
| BGA/CSP min ball pitch & ball diameter | 0.30mm, 0.15mm | |
| Placement accuracy | ±35μm (3σ), ±0.03° (3σ) | |
| Board size range | 5050mm²—1200370mm² | |
| Board thickness range | 0.3mm—6mm | |
| AOI | Min detectable component | 1005 |
| Solder joint inspection | 3D inspection capability | |
| Reflow Soldering | Temperature accuracy | ±1°C |
| Solder protection | 10 zones dual-track | |
| X-Ray | Magnification | Any magnification; System magnification 12000 |
| Resolution | 1μm/nm | |
| Rotation angle & tilt viewing angle | Any ±45°+360° rotation |
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Headquarter Address：Gangxing Road 128, Jiujiang City, Jiang Xi province, China
Sales Centre: Nanshan CTF centre Room 2603, Shenzhen; 81 St.Clement's Angel Court, Oxford
Sales Centre: Nanshan CTF centre Room 2603, Shenzhen; 81 St.Clement's Angel Court, Oxford
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